Description 1. Made of high-purity, lead-free, environmentally friendly materials with low impurities and consistent composition, ensuring full and reliable solder joints. 2. Low melting point reduces thermal shock to components during soldering, offers high insulation resistance, stable performance, and safe operation. 3. Excellent wettability and spreadability, effectively prevents bridging and ensures quick, smooth tinning. 4. Provides effective deoxidation; helps form a protective oxide film on the solder joint surface, slows down oxidation, and maintains bright, clean solder joints. 5. Advanced flux formulation produces minimal spatter, low smoke, and no strong odor during soldering. 6. Leaves minimal residue, compatible with cleaning and assembly processes, features smooth and neat winding for easy handling and feeding. 7. Suitable for electronic circuit welding, computer motherboard repair, mobile phone assembly, aerospace industry PCBs, automated soldering machines, and DIY electronics projects. Specifications: - Color: As shown - Material: Copper-tin alloy - Wire diameter: 1.0 mm - Weight: 100g - Alloy composition (by weight): Sn 99.3%, Cu 0.7% - Flux content: 2.2% ± 0.3% - Melting point range: 227°C - Halogen content: None - Density: 7.4 g/cm³ - Working temperature: 380 ± 20°C Package Includes: 1 x Solder Wire