Leaded Solder Paste

<p>&nbsp;</p> <p data-start="71" data-end="490">This high-quality 35g Leaded Solder Paste is formulated with a precise blend of Sn63/Pb37 alloy, flux, and advanced additives for strong, reliable solder joints.</p> <p data-start="71" data-end="490">Designed for&nbsp;mobile phone repair, computer servicing, high-precision circuit boards, and SMT/BGA soldering, it offers excellent wetting, smooth flow, and long-lasting adhesion. Ideal for professional and electronic repair use.</p> <p data-start="497" data-end="517">Main Features:</p> <p data-start="520" data-end="603">Premium Sn63/Pb37 composition ensures smooth soldering and strong connections</p> <p data-start="606" data-end="670">Low melting point (183&deg;C) for efficient and safe operation</p> <p data-start="673" data-end="738">Excellent wetting and high adhesion for precision soldering</p> <p data-start="741" data-end="814">Ideal viscosity stability &mdash; usable up to 48 hours after preparation</p> <p data-start="817" data-end="883">RoHS compliant and suitable for fine electronic and PCB work</p> <p data-start="886" data-end="964">Consistent performance across SMT, BGA, and micro-soldering applications</p> <p data-start="967" data-end="1043">Suitable for professional repair environments and electronic workshops</p> <p data-start="1050" data-end="1071">Specifications:</p> <p data-start="1074" data-end="1113">Material: Sn-Pb alloy (Sn63/Pb37)</p> <p data-start="1116" data-end="1142">Melting Point: 183&deg;C</p> <p data-start="1145" data-end="1170">Net Weight: 35g tub</p> <p data-start="1173" data-end="1208">Certification: RoHS Compliant</p> <p data-start="1211" data-end="1251">Viscosity Duration: Up to 48 hours</p> <p data-start="1254" data-end="1290">Operating Temperature: 22&ndash;28&deg;C</p> <p data-start="1293" data-end="1330">Recommended Humidity: RH 30&ndash;60%</p> <p data-start="1333" data-end="1432">Applications: Mobile phone, computer repair, high-precision circuit boards, SMT/BGA soldering</p>