Feature:1. FOR BGA PLANTING: Low temperature tin paste, used for BGA tin planting when repairing electronic products such as mobile phones and computers.2. FOR CHIP WELDING: Tin paste can also be used for home appliance chip patch welding and electronic production line welding, with good practicability.3. EXCELLENT TIN: Using excellent tin material, tin paste is suitable for products that are not resistant to high temperature, low energy consumption.4. HIGH PERFORMANCE: The solder joints are white and full, without false soldering, and have a strong reconciliation force with the soldering iron tip.5. HIGH EFFICIENCY: Using this low temperature tin paste instead of artificial soldering greatly improves the welding efficiency and has good wettability.Specification:Item Type: Low Temperature Tin PasteMaterial: Tin.Package List:1 x Tin PasteNote:Do not store below 0, as thawing will compromise the rheological properties of the solder paste.