Feature: 1. Accurate Alignment Measurement Value: This motherboard layering test frame adopts double ended probes to accurately align the small holes to enhance the contact performance, and the fixed clips buckle pressure, the motherboard does not buckle, the test data is more accurate. 2. Multi Function Testing: This motherboard layered test frame can test power on, display, baseband, WIFI, touch, camera, photosensitive and other functions. 3. Easy Operation: This motherboard layered test rack is easy to operate, without the need to place shims, you only need to sequentially RF motherboards, pin boards, logic motherboards, laminated stacked on the base of the test rack. 4. Copper Spring Probe: This motherboard delamination test stand adopts copper spring probe, good conductivity, stable product overload, small deviation of detection value is more accurate. 5. Wide Application: This motherboard layered test frame has a wide range of applications and is suitable for use with multiple models of cell phone motherboards, such as for iPhone 13, 13Mini, 13PRO MAX, 13PRO. Specification: Item Type: Motherboard Layered Test Frame Model: C21 Process: CNC, Etching Function: Motherboard Lamination Free Inspection Model: for iPhone13, 13Mini, 13PRO MAX, 13PRO Features: No Welding Test Plone Functions, Power On, Display, Baseband, WIFI, Touch, Camera, Sensor, etc.. Package List: 1 x Motherboard Layered Test Frame