Product Description: SFD‑227 Environmentally Friendly High Temperature Solder Paste for Mobile Phone Repair Exceptional Printing Performance: The SFD‑227 solder paste offers strong continuous printing performance, making it ideal for welding fine pitch ICs, BGAs, and other precise components. Its superior formulation ensures consistent results, even with the most intricate soldering tasks. Excellent Wettability and Mold Release: This solder paste boasts excellent wettability and mold release properties, providing strong resistance to both cold and hot collapse. Its dry resistance ensures that the paste remains effective under various environmental conditions, maintaining its integrity throughout the soldering process. Versatile for High-Precision PCB Welding: Perfectly suited for PCB welding involving high-requirement materials, the SFD‑227 is designed for fine pitch and high-precision components. It minimizes the risk of shifting and short tombstoning, ensuring reliable and accurate soldering results every time. Clean and Safe Composition: The tin in this paste is characterized by bright tin beads, leaving minimal residue that is white and transparent. Importantly, it contains no strong corrosive substances such as fluorine, making it a safer choice for both the user and the environment. Active and Rinse-Free Formula: The SFD‑227 is an active, rinse-free solder paste with minimal residuals. It is high in antioxidants, which helps to prevent oxidation and maintain the quality of the solder joints over time. Choose the SFD‑227 Environmentally Friendly High Temperature Solder Paste for your mobile phone repair needs. Its advanced formulation and eco-friendly properties make it the perfect choice for professionals seeking reliability, precision, and safety in their soldering projects.