Product Description: SFD‑228 Normal Temperature LED Solder Paste for Mobile Phone Repair Exceptional Printing Performance: The SFD‑228 solder paste is designed for strong continuous printing performance, making it ideal for welding fine pitch ICs, BGAs, and other precise components. Its formulation ensures consistent and reliable results, even for the most intricate soldering tasks. Superior Wettability and Mold Release: This solder paste offers excellent wettability and mold release properties, providing robust resistance to both cold and hot collapse. Its dry resistance ensures that the paste remains effective under various environmental conditions, guaranteeing a stable soldering process. Ideal for High-Precision PCB Welding: Perfectly suited for PCB welding with high-requirement materials, the SFD‑228 is crafted for fine pitch and high-precision components. It minimizes the risk of shifting and short tombstoning, ensuring reliable and accurate soldering results every time. Clean and Safe Composition: The tin in this paste is characterized by bright tin beads, leaving minimal residue that is less white and transparent. Importantly, it contains no strong corrosive substances such as fluorine, making it a safer choice for both the user and the environment. Active and Rinse-Free Formula: The SFD‑228 is an active, rinse-free solder paste with minimal residuals. It is high in oxidation resistance, which helps to prevent oxidation and maintain the quality of the solder joints over time. Choose the SFD‑228 Normal Temperature LED Solder Paste for your mobile phone repair needs. Its advanced formulation and user-friendly properties make it the perfect choice for professionals seeking reliability, precision, and safety in their soldering projects.