Features: 1. The use of high-performance thixotropic agents can effectively prevent collapse during printing and preheating, and special flux ensures good printing and fine patterns. 2.More advanced insulation technology, long-lasting adhesion, not easy to dry, sticky time up to 48 hours 3. High quality, unique formula, perfect performance,easy to weld. 4.The residue is colorless and transparent, does not affect the detection, and has excellent cleaning and cleaning performance. 5.The product has good wettability and strong dry resistance. It has a long shelf life at normal temperature and is suitable for mobile phone repair, computer digital repair industry, high precision circuit board SMT soldering, BGA process soldering, etc. Specification: Size: 35x15mm Melting point: 183 degrees Celsius Composition: Sn63/Pb37 Storage: Solder paste is usually refrigerated in a refrigerator. The refrigerating temperature is preferably 5-10 degrees Celsius. includes:1x Welding Tin Paste About shlpping: All items will be shlpped within 3 business days after the payment is received. Most times you will receive them within 8-12 days then. The specific delivery time is depend on circumstances.Any questions, please feel free to contact us During the shopping process, if you have any questions, please feel free to consult us, we will reply you within 24 hours, wish you a happy shopping Thanks for your cooperation and we'll make you feel satisfied.